Custom PCBs
Purpose-built boards for industrial robots — sensor interface, power distribution, isolated fieldbus and compute carriers. Designed for the temperature, vibration and EMC realities of a plant floor.
00Physical AI
We design custom PCBs for humanoid, land and aerial robots, and pair them with a driver layer that speaks to standardized industrial sensors — whichever OEM they come from. One API. Any hardware. Industrial grade only.
01What we do
Robot builders lose months writing glue code for sensors and re-spinning boards for every new platform. We remove both problems.
Purpose-built boards for industrial robots — sensor interface, power distribution, isolated fieldbus and compute carriers. Designed for the temperature, vibration and EMC realities of a plant floor.
One API across sensor vendors. Swap a LiDAR, encoder or force-torque unit for another OEM's part and your application code does not change. We take the standard drivers OEMs ship and normalize them.
We integrate standardized industrial sensors only — no hobby-grade parts. We work with the industrial OEM ecosystem so the sensors on your robot are the same class as the ones on the line beside it.
02Platform
Your autonomy code sits on top. Everything below it is ours to keep stable while the hardware underneath keeps changing.
Perception, navigation, manipulation, autonomy, fleet logic. Untouched by hardware changes.
Uniform types, units, timestamps, frames and health reporting across every supported device class.
The standard drivers each OEM ships, wrapped, version-pinned, tested and made to behave identically.
EtherCAT, CANopen, PROFINET, IO-Link, EtherNet/IP, Modbus, TSN and deterministic Ethernet timing.
Sensor front-ends, isolation, power rails, safety I/O and an edge-compute carrier on one board.
Standardized industrial parts from the OEM ecosystem. Interchangeable by design.
Change vendor at L0 and nothing above L3 moves. Procurement stops being an engineering event.
Real-time scheduling, bounded jitter and synchronized timestamps across every sensor on the bus.
Version-pinned drivers, traceable board revisions and test evidence for every supported part.
03Hardware
Every industrial robot programme eventually hits the same wall: the off-the-shelf carrier board cannot take the sensors, the power or the environment. We design the board around your platform instead.
04Sensors
We partner across the industrial OEM sensor ecosystem and take the standard drivers they provide. These are the device classes our driver layer covers.
| Device class | Typical devices | Interface |
|---|---|---|
| LiDAR & 3D ToF | 2D safety scanners, 3D LiDAR, time-of-flight depth | Ethernet, EtherCAT |
| IMU & AHRS | Inertial units with characterized bias stability | SPI, CAN, RS-422 |
| Encoders | Absolute and incremental, rotary and linear | EtherCAT, SSI, BiSS |
| Force–torque & load | Six-axis force-torque sensors, load cells | EtherCAT, CANopen |
| Machine vision | Industrial cameras with synchronized triggering | GigE Vision, USB3, MIPI CSI-2 |
| Functional safety | Safety scanners, light curtains, e-stop chains, STO | Safety I/O, FSoE |
| Proximity & presence | Inductive, capacitive, photoelectric, ultrasonic | IO-Link, discrete I/O |
| Radar & GNSS-RTK | All-weather radar, centimetre-grade positioning | CAN, Ethernet, UART |
| Process & power | Temperature, pressure, flow, current, voltage | IO-Link, Modbus, I²C |
05Platforms
The physics differ. The sensor problem does not. Our boards and drivers target all three classes of industrial robot.
Dense joint sensing, force-torque at the wrists and ankles, and tight timing budgets across dozens of devices on the same bus.
Quadrupeds, AMRs and tracked platforms. Outdoor perception, wheel and track odometry, and safety-rated obstacle detection.
Inspection and survey platforms where mass budget, redundancy and certified sensor provenance all matter at once.
06Company
We were in stealth until January 2026. With investors on board, we are moving into the next stage — and that stage runs through India.
Design & R&D
Core PCB design and the driver layer. Where the architecture gets decided and the hard electronics work happens.
Headquarters & design
Founding team, customer engineering and platform design, working alongside Finland on every board revision.
Sales office · scale-up & test next
A sales office today. As infrastructure and legal setup complete, we grow headcount into product scale-up and testing.
India has the potential and the know-how to build this locally. We are not opening a back office here — we are moving the scale-up and the testing of our products into the country.
Board architecture and the hardware-agnostic driver layer built quietly out of Finland and the USA.
Platform made public. First industrial engagements across humanoid, land and aerial robots.
Investors on board. Sales office established in India while infrastructure and legal setup proceed.
Headcount grows into product scale-up, test engineering and volume validation on the ground.
07Team
Founders in the USA. Design out of Finland. Testing and commercial presence growing in India.
Co-founder & CEO
United States · from Finland
Sets the platform direction and carries the Finnish design side of the company into customer programmes.
Co-founder & CTO
United States · from China
Owns the hardware-agnostic driver architecture and the PCB platform across all three robot classes.
Product Testing
India
Builds the validation and hardware-in-the-loop test practice that product scale-up in India will run on.
Sales
India
First commercial presence in India, working with industrial robot builders and OEM sensor partners.
We are hiring in India as the infrastructure and legal setup complete — starting with test and scale-up engineering. Get in touch.
08Contact
Robot builders, industrial OEMs and sensor partners — we would like to hear from you. If you are evaluating a board or a sensor integration, send the part numbers and we will tell you where we stand.